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Hi Fu-Chiang Please upload thermal test report of DVT1 sample in this mantis. Regards, Sean |
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Hi Lonnie, Update the thermal test report via VOP video stream through VPN. The power of thermal test cannot record due to no AC source for measurement. Currently we use SW image version is 19.522.44 and it seems more loader than 19.522.07. So the SOC temperature is higher than before. We are testing with play 4K local video and iperf 400Mbps throughput and E-loader to USB ports as before test conditions. Please wait for next test results. Thank you. |
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Hi, Fu-chiang Young What is your next plan? Best regards Lonnie Kim |
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Hi Lonnie, We compare the thermal test power consumption, it is quite different with different image version. Please see the attached file. So the latest image(19.522.44) is more load for SOC on DVT build than EVT build(19.522.07). Thank you. power consumption.png (72,220 bytes) |
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Hi, Fu-chiang Young So, what is your idea? Can your SW team reduce power consumption? EVT stage is earlier than DVT stage, so SW may be simpler than DVT SW. I want to know how to improve thermal issue. Best regards Lonnie Kim |
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Hi Mr.Yoon and Lonnie, The reason we provide these information to you is want to let you know that the test condition (mainly on S/W) between EVT and DVT are different, and you have to know the additional temperature rising seems was caused by SoC consume more power in DVT sample. Therefore, my point here is want to explain to you if we use the same software version as the EVT in DVT sample, the temperature of bottom surface should also passl. And I have emphasize many times with ALT, since the housing size doesn't has any change, so I think we don't have much room to reduce thermal from hardware perspective. We will check with our S/W team to understand the detailed S/W difference, and let you know if any possibility to reduce from S/W method. Also, we will discuss with our thermal team to see if there is any better way to spread the heat based on current thermal solution and housing structure Regards, Sean |
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Hi Lonnie, We check the app services between both versions 19.522.07 and 19.522.44, the ampservices has quite different usage on SOC. Please see the attached file. 19.522.44 new image seems to make SOC usage increase higher. Our SW team cannot do anything to decrease services usage due to the app is not built by our SW team. That may need mid-ware team help. Thank you. services compare.png (152,381 bytes) |
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Hi Lonnie, Sorry for caused misunderstanding. This issue should not mid-ware issue, it is SDK issue. So we open a jira for Synaptics to solve the higher SOC usage issue. The jira number is SKBSBALT-131 (Ampservice occupied higher SOC usage.) Thank you. |
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Hi Lonnie, We and Synaptics had con-call and discussed this ampservices issue. And we found no matter which image version, but it is related to that when UI login to SKB server through VPN, the ampservices app is more busy and higher SOC usage. So we will try to compare login and non-login of ampservices app by profiling this app. Synaptics will help us to analysis this issue when login to increase more busy to access ampservices app. Thank you. |
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Hi Lonnie, Update the thermal test for adding graphene sheet inside the bottom cover. The results are not good but increase the bottom cover temperature higher than before. We plan to do bottom thermal heatspreader sample for made bigger dent area to replace original currently using. We expect will decrease 3 deg-C maximum. Also change different thickness bottom heatspreader for test. Please see the attached files. ME will provide the proposal and will update later. Thank you. bottom side of heatspreader.jpg (152,990 bytes) |
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2021-03-22 07:56 developer |
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Hi Lonnie, Update the new heatspreader proposal includes thickness. Thank you. |
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add thermal simulation report 2021.04.08 by Fii |
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@Sean. Here is new thermal simulation condition requested by ALT. Please proceed thermal simulation apply attachment condition Thanks SON |
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Hi SH, Please find attached for the thermal simulation report according to ALT's request. The key components are still fail @ 50degC ambient but the temperaure of the parts on AMP board is indeed lower than the previous results. Please review it and let us know if you have any questions. In the meanwhile, ME Jim just review the aluminum die-casting and think it may not be well fixed in the current housing structure because of its heavy weight. ME Jim is checking on that and will prepare our comment and proposal to you later. Thanks, Regards, Sean |
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Hi Sean & Bryan As we talk just now, please provide new solution & simulation with copper pipe ＆ fan, please provide the simulation result & proposal ASAP, thanks. The spec can't be widened by the customer, so please try to solve this thermal issue in another way, thanks. |
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Hi Seam and Bryan, There are some misunderstandings. We didn't ask to simulate heat pipe and fan. It cannot be a solution for our issue. It may occur additional noise. So please check other solution, not heat pipe and fan. As you know, we don't have enough time. Now we should select our thermal solution to meet customer's requirement. |
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Hi Mr.Yoon, We understand that the fan will cause the noise. So we also don't recommaned to use fan. According to our discussion yesterday, we will change material of the heatspreader to copper and will use the VC (Vapor Chamber) solution to improve the thermal conductivity as the next thermal simulation condition. We will update the result to you tomorrow morning. Thanks! Regards, Sean |
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Hi Lonnie and SH, Please find attached for the thermal modeling data. Thanks! PW: 123456 Regards, Sean |
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Hi, Sean I update thermal simulation condition. Please proceed thermal simulation. Best regards Lonnie Kim |
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Hi Lonnie, We will perform a new simulation based on the conditions you provided and try to update you result by this Friday. However, I realized that you reduce the volume of the speaker 50% to reduce the power. And that's mean if this condition can pass the test, and then would you recommend it to SKB? Please let us know your next plan for the thermal. Thanks! Regards, Sean |
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Hi Lonnie, Update thermal simulation result according to the new simulation condition (reduce 50% speaker volume). Both VC and AL HSR can pass criteria of all components but the housing surface are still marginal fail. Please check it and let us know if there is any further questions. Thanks, Regards, Sean |
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Hi, Sean Thank you for your update. Could you update components temperature table? Best regards Lonnie Kim |
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Hi Lonnie, Update the DVT1 sample thermal test. We change the bottom heatspreader with bigger dent area. The test result is pass. Thank you. |
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Hi Lonnie, Update the picture for new bottom heatspreader. Thank you. new bottom heatspreader.jpeg (148,001 bytes) |
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Hi Lonnie, Update the picture for comparing old and new heatspreader. Thank you. |
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Hi Mr. Fu-chiang Young and Mr. Sean Chiang, Thank you for your update. I have question. It is very impressive that we can reduce Temperature of Top & Bottom. But it is DVT1 result. Can you test with DVT2 + New Amp b'd with your thermal simulation condition ? I hope these solution can reduce with new AMP B'd. If you have plan, then please let me know. |
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Hi Mr.Yoon, The purpose of the modification of the new heatspreader is to reduce the temperature of the bottom case, and it seems that solution is works and meets our expectation. As discussed in regular meeting this morning, please send us the DVT3 housing and new speakers asap, then we will arrange the thermal test using DVT2+new AMP board soon. Thanks, Regards, Sean |
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Hi Sean and Henry ALT is confirm the heat spreader design for MP. SoC Bottom and SoC Top : 0001101:0006918 Amp bottom and Top : 0001143:0006415 Please update the heatspreader modeling data below mantis 0001171:0006971 Thanks SON |
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Hi Lonnie, Update the thermal test report for DVT3 sample. Thank you. |
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Hi Fu-chiang Young FW change and housing surface temp retest requested. Best regards Jung |
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Dear Mr. Sun, Due to T1 tooling had damaged to do other test such as logo/printing test, no T1 tooling could do thermal test again. We check the power consumption for 19.531.13 and 19.531.17 both image, the power test results on operation mode are almost the same. Could we waive this test with different image for thermal test? Please refer the attached picture for operation mode power consumption test. https://mantis.cnsbg.foxconn.com/vaas/view.php?id=1074 Thank you. Operation mode power consumption.png (206,353 bytes) |
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Hi Fu-chiang Young The Thermal test result is housing top and housing bottom of fail (SKB Thermal Spec : housing surface under 40°C) Housing surface temperature retest to condition requires ( Test condition : in chamber 25°C for 3hours ) Beat regards jung housing surface temp.PNG (80,659 bytes) |
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Hi Sun, Can you check with Mr.Yoon about the thermal test spec.? We did discussed with Mr.Yoon a couple of times, and we think the delta 15°C for bottom is too strict for the product. So, I believe that we have consensus before is that we try to improve the temperature raising at bottom is 20 °C. If there is no problem, then we will update the thermal spec. of top/bottom to 40°C/45°C. @ 25°C. ambient. Let us know if there is any further questions. Thanks! Regards, Sean |
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Hi, Sean We know 15'C is very strict but that is SKB spec. And, SKB will judge manual investigate after submit report. So, report should describe current status. Please describe "fail" if over 15'C, and we will discuss about wavier with SKB. Best regard Lonnie Kim |
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Hi Lonnie and Sun, Update the thermal test report as delta 15 °C as spec. Thank you. |
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Dear ALT team, I would like to close these open issues on mantis since they are related to the EVT/DVT HW test items, releability, certificaions etc., and should have passed with good result. So, You can reopen it if you found any issues and would like to raise it again for further discussion. Thanks, Regards, Sean |
- yk.jung ( (ALTech) Younkwang Jung ) developer
